Light emitting device

摘要

With a light emitting device of a package formed by two types of molded resins, entry of water from between the molded resins may cause the light emitting device to be incapable of turning on. A light emitting device of the present invention includes: a package that has an opening at an upper surface thereof; a first molded resin that forms a part of the upper surface of the package; a second molded resin that forms an inner wall surface of the opening of the package; a lead frame that is buried in the package so as to be partially exposed at a bottom surface of the opening of the package, the lead frame having an end portion externally projected outside from a side surface of the package; and a light emitting element that is connected to an upper surface of the lead frame being exposed at the bottom surface of the opening. The second molded resin is higher than the first molded resin in light reflectance to light emitted from the light emitting element. The upper surface of the lead frame buried in the package is disposed so as to be spaced apart from the interface between the first molded resin and the second molded resin.

主权项

1. A light emitting device comprising: a package that has an opening at an upper surface side thereof; a lead frame that is buried in the package so as to be partially exposed at a bottom surface of the opening of the package, the lead frame having a portion forming a portion of a side surface of the light emitting device; and a light emitting element that is connected to a portion of an upper surface of the lead frame that is exposed at the bottom surface of the opening, wherein the package includes; a first molded resin that has a first upper surface that forms a part of the upper surface of the package, and a second molded resin that has (i) an inner wall surface that forms an inner wall surface of the opening of the package, and (ii) a second upper surface that forms a part of the upper surface of the package and that surrounds the opening at an inner side of the first upper surface; wherein the second molded resin is higher than the first molded resin in light reflectance to light emitted from the light emitting element, wherein a portion of the upper surface of the lead frame that is buried in the package is disposed so as to be spaced apart from an interface between the first molded resin and the second molded resin and wherein the side surface of the package includes a first side surface that is formed by the first molded resin and a second side surface that is formed by the second molded resin.