Chip arrangement with a recessed chip housing region and a method for manufacturing the same

摘要

A chip arrangement may include: a semiconductor chip; an encapsulating structure at least partially encapsulating the semiconductor chip, the encapsulating structure having a first side and a second side opposite the first side, the encapsulating structure including a recess over the first side of the encapsulating structure, the recess having a bottom surface located at a first level; and at least one electrical connector disposed at the first side of the encapsulating structure outside the recess, wherein a surface of the at least one electrical connector facing the encapsulating structure may be disposed at a second level different from the first level.

主权项

1. A chip arrangement, comprising:
a semiconductor chip; an encapsulating structure completely encapsulating the semiconductor chip, the encapsulating structure having a first side and a second side opposite the first side, the encapsulating structure comprising a recess over the first side of the encapsulating structure, the recess having a bottom surface located at a first level and at least one side wall; a redistribution structure extending across the bottom surface of the recess and over the at least one side wall, wherein a portion of the redistribution structure extends outside the recess; at least one electronic device fixed to the bottom surface of the recess and electrically coupled to the redistribution structure, wherein the at least one electronic device is at least partially contained in the recess; and wherein an active side of the electronic device faces the bottom surface of the recess; and at least one electrical connector disposed at the first side of the encapsulating structure outside the recess, wherein a surface of the at least one electrical connector facing the encapsulating structure is disposed at a second level different from the first level.