发明名称 |
Methods of manufacturing large-area sputtering targets using interlocking joints |
摘要 |
In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding. |
申请公布号 |
US9108273(B2) |
申请公布日期 |
2015.08.18 |
申请号 |
US201213628090 |
申请日期 |
2012.09.27 |
申请人 |
H.C. Starck Inc. |
发明人 |
Volchko Scott Jeffrey;Loewenthal William;Zimmermann Stefan;Gaydos Mark;Miller Steven Alfred |
分类号 |
B05D1/02;B23K31/02;C23C14/34;C23C24/04 |
主分类号 |
B05D1/02 |
代理机构 |
Morgan, Lewis & Bockius LLP |
代理人 |
Morgan, Lewis & Bockius LLP |
主权项 |
1. A method of forming a joined sputtering target comprising a sputtering material, the method comprising:
forming a mechanical joint between two discrete sputtering-target tiles by (i) overlapping or (ii) overlapping and interlocking the tiles at an interface therebetween, the interface comprising a recess over the mechanical joint, and each of the tiles consisting essentially of the sputtering material; after (i) overlapping or (ii) overlapping and interlocking the tiles at the interface therebetween, joining the tiles by welding the mechanical joint; and thereafter, spray-depositing a spray material over at least a portion of the welded mechanical joint to substantially fill at least a portion of the recess, thereby forming the joined sputtering target. |
地址 |
Newton MA US |