Semiconductor device and method of fabricating the same

摘要

According to one embodiment, a semiconductor device, including a semiconductor layer including a first region and a second region isolated from the first region, a source in a surface of the first region, a drain in a surface of the second region, a back-gate in the surface of the source, a gate insulator on a surface of the first region, an end of a drain side of the back-gate being located closer to the drain side than an end of the drain side of the source, a gate insulator on a surface of the semiconductor layer between the first region and the second region, a gate electrode on the gate insulator, a source electrode being contacted to both the source and the back-gate, and a drain electrode being contacted to the drain area.

主权项

1. A semiconductor device, comprising:
a semiconductor layer comprising a first region and a second region isolated from the first region; a source area of a first conductivity type provided on a surface of the first region; a drain area of the first conductivity type provided on a surface of the second region; a back-gate area of a second conductivity type provided on the surface of the first region, the back-gate area having a first portion adjacent to the source area and a second portion spaced from the source area by the first portion, the second portion being at a distance from the drain area that is less than a distance between the source area and the drain area and less than a distance between the first portion and the drain area; a gate insulator on a surface of the semiconductor layer between the first region and the second region; a gate electrode on the gate insulator, a portion of the gate electrode on a side of the first region having a recessed portion above the second portion of the back-gate area.