Semiconductor device and manufacturing method thereof

摘要

An object relates to an electrode of a semiconductor device or a method for manufacturing a semiconductor device, which includes a bonding step, and problems are: (1) high resistance of a semiconductor device due to the use of an Al electrode, (2) formation of an alloy by Al and Si, (3) high resistance of a film formed by a sputtering method, and (4) defective bonding in a bonding step which is caused if a bonding surface has a large unevenness. A semiconductor device includes a metal substrate or a substrate provided with a metal film, a copper (Cu) plating film over and bonded to the metal substrate or the metal film by employing a thermocompression bonding method, a barrier film over the Cu plating film, a single crystal silicon film over the barrier film, and an electrode layer over the single crystal silicon film.

主权项

1. A solar cell comprising:
an insulating substrate; a metal film over and in direct contact with the insulating substrate; a copper (Cu) plating film over and in direct contact with the metal film; a seed film over and in direct contact with the Cu plating film; a barrier film over and in direct contact with the seed film; a photoelectric conversion layer over and in direct contact with the barrier film; an electrode layer over the photoelectric conversion layer; a first wiring over and in direct contact with the metal film, the first wiring does not overlap with the Cu plating film; and a second wiring over and in direct contact with the electrode layer, wherein the Cu plating film is formed by growth from the seed film, wherein the electrode layer is formed with a transparent conductive material, wherein the barrier film is one of titanium (Ti) film, tantalum nitride film, tantalum (Ta) film and tungsten (W) film, and wherein the photoelectric conversion layer is a single crystal silicon film wherein a thickness of the single crystal silicon film is larger than or equal to 50 nm and smaller than or equal to 200 nm.