发明名称 Rigid flex circuit board
摘要 Systems, methods and articles of manufacture for rigid flex circuit boards are described herein. Embodiments of the present disclosure relate to equipping a rigid flex circuit board with a first rigid substrate, a second rigid substrate that includes an asymmetric region where the first rigid substrate is not extended over the asymmetric region of the second rigid substrate. The rigid flex circuit board also includes a flexible substrate between the first rigid substrate and the second rigid substrate. A second portion of the flexible substrate protrudes from the non-overlap region where the second portion of the flexible substrate is not adhered to the second rigid substrate in the non-overlap region. The second portion of the flexible substrate is configured to be accessible from the asymmetric region of the rigid flex circuit board.
申请公布号 US9113551(B2) 申请公布日期 2015.08.18
申请号 US201213661585 申请日期 2012.10.26
申请人 Google Inc. 发明人 McClatchie Iain Richard Tyrone;Muldoon Ian
分类号 H05K1/03;H05K7/02;H05K1/02;H05K1/14 主分类号 H05K1/03
代理机构 Lerner, David, Littenberg, Krumholz & Mentlik, LLP 代理人 Lerner, David, Littenberg, Krumholz & Mentlik, LLP
主权项 1. A rigid flex circuit board, comprising: a first rigid substrate; a second rigid substrate that includes a non-overlap region, wherein the first rigid substrate is not extended over the non-overlap region of the second rigid substrate; a first portion of a flexible substrate between the first rigid substrate and the second rigid substrate, wherein the first rigid substrate, the second rigid substrate and the first portion of the flexible substrate are bonded together; and a second portion of the flexible substrate that protrudes from the non-overlap region, wherein the second portion of the flexible substrate is not adhered to the second rigid substrate in the non-overlap region.
地址 Mountain View CA US