发明名称 |
THERMAL CATIONIC POLYMERIZABLE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE PRODUCTION METHOD AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermal cationic polymerizable composition which has sufficient storage stability and good balance in terms of suppression of lifting at an adhesion interface, adhesive strength and conductive particle capture efficiency. ! SOLUTION: A thermal cationic polymerizable composition comprises: a thermal cationic polymerization initiator which contains a compound A represented by a prescribed general formula (1) and a compound B represented by a prescribed general formula (2); and a binder component. The ratio of the mass of the compound A to the total mass of the compound A and the compound B is from 0.5 to 0.995 inclusive. ! COPYRIGHT: (C)2015,JPO&INPIT |
申请公布号 |
JP2015145446(A) |
申请公布日期 |
2015.08.13 |
申请号 |
JP20140017774 |
申请日期 |
2014.01.31 |
申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
SHIMURA TADASHI ; KAMIMURA NAOYA ; SHIMADA HITOSHI |
分类号 |
C08L101/00;C08K5/36;H01B5/16;H01R11/01;H01R43/00 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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