| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing system that is capable of improving the uniformity of the processing over the entire surface area of each printed circuit board and among multiple printed circuit boards processed in any single processed lot of boards.SOLUTION: There is provided an apparatus for treating products with plasma generated from a source gas. The apparatus includes a vacuum chamber, a plurality of juxtaposed electrodes arranged in adjacent pairs inside the vacuum chamber, and a plasma excitation source electrically coupled with the electrodes. The apparatus includes conductive members extending into the interior of each electrode to establish an individual electrical connection with the plasma excitation source. The apparatus includes a gas distribution manifold and multiple gas delivery tubes coupled with the gas distribution manifold. Each gas delivery tube has an injection port configured to inject the source gas between each adjacent pair of electrodes. The apparatus further includes flow restricting members that operate to partially obstruct a peripheral gap between each adjacent pair of electrodes, which restricts the escape of the source gas from a process chamber between each adjacent pair of electrodes. |
