发明名称 VEIN IMAGING DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To decrease thickness of a device while achieving reception of reflected light from an object with high accuracy.SOLUTION: A sensing device is provided, which includes a light-emitting unit 20 positioned on an object F side of a light-receiving unit 30. The light-emitting unit 20 includes: a light-emitting layer 26 that emits irradiation light IL; a first electrode 22 that transmits the irradiation light IL and reflected light RL; a second electrode 24 that blocks the irradiation light IL and the reflected light RL, and has an opening formed therein; and an insulating layer 28 that is disposed at a position corresponding to the opening of the second electrode 24, blocks the irradiation light IL and the reflected light RL, and partially insulates between the first electrode 22 and the second electrode 24. The light-receiving unit 30 includes a light-receiving element D that receives the reflected light RL. A light-shielding layer BM is disposed at a position corresponding to the opening of the second electrode 24, blocks the irradiation light IL and the reflected light RL, and has an opening formed therein. In a plan view from the object F side, the light-shielding layer BM overlaps the opening of the second electrode 24 and the light-receiving face of the light-receiving element D is located within the opening of the light-shielding layer BM.
申请公布号 JP2015146203(A) 申请公布日期 2015.08.13
申请号 JP20150044363 申请日期 2015.03.06
申请人 SEIKO EPSON CORP 发明人 KANDA EIJI;ISHIGURO HIDETO;EGUCHI TSUKASA;FUJITA TETSUJI;YAMAMOTO HIDETOSHI
分类号 G06T1/00;A61B5/117;H01L27/14;H04N1/028 主分类号 G06T1/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利