MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF

摘要

An embodiment of the present invention relates to a method of manufacturing a semiconductor device and a semiconductor device thereof. A technical objective to be solved is to provide a method of manufacturing a semiconductor device which is thin, has excellent electrical properties and small warpage without using a PCB, and a semiconductor device thereof. For this, the method of manufacturing a semiconductor device includes a step of forming a back end of line (BEOL) layer on a dummy substrate; a step of electrically connecting the BEOL and a semiconductor die; a step of firstly encapsulating the BEOL layer and the semiconductor layer with a first encapsulant; a step of removing the dummy substrate from the BEOL layer; a step of connecting a solder ball to the BEOL layer; a step of secondarily connecting the BEOL and the solder ball with a second encapsulant; and a step of electrically connecting a semiconductor package to the BEOL layer.