发明名称 電子部品、電子装置、電子機器および電子装置の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component, an electronic device, an electronic apparatus, and a manufacturing method of the electronic device which prevent from insects or the likes from intruding into a lead, also prevents tracking of the lead due to humidity, and enables easy assembling at low cost. <P>SOLUTION: An electronic component 1 includes: a circuit part 2; a first resin 3 sealing the circuit part 2; a lead 4 which electrically connects with the circuit part 2 and has an end part 4a extending so as to protrude from the first resin 3; and a second resin 5 having Young's modulus smaller than that of the lead 4. The second resin 5 is formed so as to contact with and cover the lead 4 except a tip part 4b of the end part 4a. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5763512(B2) 申请公布日期 2015.08.12
申请号 JP20110263428 申请日期 2011.12.01
申请人 发明人
分类号 H01L23/29;F24F1/20;H01L23/31 主分类号 H01L23/29
代理机构 代理人
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地址