A curable composition including (a) at least one epoxide compound comprising: (i) at least one solid or semi-solid epoxy resin; and (ii) at least one divinylarene dioxide resin compound; and (b) at least one hardener; wherein the curable composition being cured comprises a cured thermoset product having a Tg of greater than about 120° C. A thermoset can be prepared from the above curable composition.
