| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in the flowability of the composition and attaining moisture-resistant reliability suitable for recent year electronic part-related materials, and high flame retardancy free from halogens for harmonizing environments, to provide its cured product, to provide a semiconductor-sealing material using the composition, to provide a polyhydroxy compound giving the performance, and to provide an epoxy resin. <P>SOLUTION: The compound represented by general formula (I) (wherein, G; hydroxy, glycidyloxy, X; a direct bond, an oxygen atom, R; a hydrogen atom, 1-10C alkyl, alkoxy, aryl, aralkyl, a halogen atom, j and k; each an integer of 1-4; n; an integer of 0-5; R'; naphthylmethyl, antonyl methyl, m; an integer of 1-4). The thermosetting resin composition contains the compound. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
