发明名称 半導体装置
摘要 According to one embodiment, a semiconductor device includes: a substrate; a first circuit portion; and a second circuit portion. The first circuit portion includes: a first and a second switching elements, and a first and a second diodes. The second circuit portion includes a third and a fourth switching elements, and a third and a fourth diodes. The first switching element is juxtaposed with the second switching element in a first direction, and is juxtaposed with the fourth switching element in a second direction. The third switching element is juxtaposed with the fourth switching element in the first direction, and is juxtaposed with the second switching element in the second direction. A voltage is applied to electrodes of the first and third switching elements. A voltage of a polarity opposite the first voltage is applied to electrodes of the second and fourth switching elements.
申请公布号 JP5763026(B2) 申请公布日期 2015.08.12
申请号 JP20120210188 申请日期 2012.09.24
申请人 发明人
分类号 H01L25/07;H01L25/18;H02M1/00;H02M7/48 主分类号 H01L25/07
代理机构 代理人
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