发明名称 Method of manufacturing a hybrid heat-radiating substrate
摘要 Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
申请公布号 US9107313(B2) 申请公布日期 2015.08.11
申请号 US201314133157 申请日期 2013.12.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 Lim Chang Hyun;Kang Jung Eun;Park Heung Soo;Choi Seog Moon;Kim Kwang Soo;Chae Joon Seok;Park Sung Keun
分类号 H05K7/06;H05K3/10;H05K1/02;H05K3/44;H05K1/05 主分类号 H05K7/06
代理机构 Bracewell & Guiliani LLP 代理人 Bracewell & Guiliani LLP ;Chin Brad Y.
主权项 1. A method of manufacturing a hybrid heat-radiating substrate, comprising: providing a metal core member; forming an oxide insulating core layer by performing volume anodizing on the metal core member in a thickness direction; forming an oxide insulating layer by performing surface anodizing on one surface or both surfaces of the metal core member; and forming a circuit layer that is configured to include first circuit patterns positioned on the oxide insulating core layer and second circuit patterns positioned on the oxide insulating layer, wherein the oxide insulating layer has a thickness thinner than the oxide insulating core layer.
地址 Gyunggi-Do KR