| 摘要 |
A copper foil with a carrier is provided. Said copper foil with a carrier makes it possible to form microscopic wiring with an L/S smaller than 20 mm/20 mm, e.g. 15 mm/15 mm. This copper foil with a carrier has the following, in this order: a copper-foil carrier, an intermediate layer, and an ultrathin copper layer. The intermediate layer contains nickel. If this copper foil with a carrier is heated for two hours at 220oC and the ultrathin copper layer is then separated in accordance with JIS C 6471, the amount of nickel on the intermediate-layer-side surface of the ultrathin copper layer is between 5 and 300 mg/dm2, inclusive. |
