| 摘要 |
<p>Provided in an embodiment of the present invention are an apparatus and a method for treating a substrate. The substrate treating apparatus comprises a chamber including an opening having a substrate entered on one side, and providing a treating space inside; a stage located in the treating space, and supporting the substrate; a heating member provided in the stage to heat the substrate supported on the stage; a door assembly having a door opening and closing the opening; and a blocking member blocking inflow of an outer air flow into the treating space, wherein the blocking member includes a gas nozzle installed on the one side; a gas supply line providing a blocking gas to the gas nozzle; and a heater installed on the gas supply line to heat the blocking gas provided through the gas supply line. The blocking gas blocks an entrance where the substrate enters to prevent inflow of the outer air flow into the chamber.</p> |
