| 发明名称 |
THICK BOND PAD FOR CHIP WITH CAVITY PACKAGE |
| 摘要 |
Disclosed herein a method, including depositing a silicon nitride layer over an inter layer dielectric (ILD); depositing a first conductive layer having a first thickness; forming a mask over a first portion of the first conductive layer to expose a second portion of the first conductive layer; etching the first conductive layer; etching the silicon nitride layer with a fluorine-based etch; and depositing a second conductive layer having a second thickness. |
| 申请公布号 |
US2015221698(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201514688215 |
申请日期 |
2015.04.16 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Gambino Jeffrey P.;Leidy Robert K.;Rassel Richard J. |
| 分类号 |
H01L27/146;H01L21/768 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
depositing a silicon nitride layer over an inter layer dielectric (ILD); depositing a first conductive layer having a first thickness; forming a mask over a first portion of the first conductive layer to expose a second portion of the first conductive layer; etching the first conductive layer; etching the silicon nitride layer with a fluorine-based etch; and depositing a second conductive layer having a second thickness. |
| 地址 |
Armonk NY US |
