发明名称 PACKAGING MATERIAL AND MOLDED CASE
摘要 <p>PROBLEM TO BE SOLVED: To provide a packaging material in which sufficient seal strength can be obtained and appearance quality is excellent while wrinkles are hardly generated.SOLUTION: A packaging material 1 includes a heat-resistant resin layer 2 as an outer layer, a thermoplastic resin film layer 3 as an inner layer, and a metal foil layer 4 disposed therebetween. For the thermoplastic resin film 3, a thermoplastic resin film, in which tensile yield strength in a film extrusion direction, tensile yield strength in a direction orthogonal to the film extrusion direction, tensile yield strength in a direction of a right oblique angle of 45 degrees with respect to the film extrusion direction, and tensile yield strength in a direction of a left oblique angle of 45 degrees with respect to the film extrusion direction are equal to 15 MPa or more respectively, is used.</p>
申请公布号 JP2015143107(A) 申请公布日期 2015.08.06
申请号 JP20140016373 申请日期 2014.01.31
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 HOU WEI;KURAMOTO AKINOBU;KARATSU MAKOTO;NAGATA KENSUKE
分类号 B65D65/40;B32B15/08;B32B15/085;B65D1/00;B65D81/24;H01M2/02 主分类号 B65D65/40
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