| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure in which high packaging position precision and a sufficient bonding strength are secured while preventing the occurrence of packaging trouble where an electronic component rises during packaging.SOLUTION: A packaging structure 1A includes: an electronic component 10 including external electrodes 15 and 16; a wiring board 20A including lands 25 and 26; and bonding parts 31 and 32 formed from a solder bonding material. The bonding part 31 bonds the external electrode 15 and the land 25, and the bonding part 32 bonds the eternal electrode 16 and the land 26. The external electrodes 15 and 16 include: cover parts 15a and 16a covering a principal surface 11a2 of an element assembly 11 opposing the wiring board 20A; and cover parts 15b and 16b covering end faces 11b1 and 11b2 being positioned oppositely in a length direction L of the element assembly 11, respectively. A distance De between the cover parts 15a and 16a in the length direction L and a distance Dl between the lands 25 and 26 in the length direction L meet a condition of 0.91≤Dl/De≤1.09. |
