| 摘要 |
A thermosetting resin composition containing (a) a polyfunctional (meth)acrylate, (b) a high-thermal-conductivity filler having a thermal conductivity of 20-250 W/m∙K, (c) a curing agent, and (d) a copolymer having an acid group containing phosphoric acid, the thermosetting resin composition characterized in that the content of the high-thermal-conductivity filler (b) is 1600-2100 parts by mass with respect to 100 parts by mass of the polyfunctional (meth)acrylate (a), and the content of the copolymer having an acid group containing phosphoric acid (d) is 7.5-30 parts by mass with respect to 100 parts by mass of the polyfunctional (meth)acrylate (a). |
