| 摘要 |
<p>A power semiconductor device according to the present invention comprises power semiconductor components, a basic body, and a plurality of capacitors. The power semiconductor device further comprises a capacitor mounting device having an integrated frame device pulled above the capacitors and an integrated clamp device. The frame device comprises frame elements having long cutout units. Each frame element forms a frame element finger enclosing a side surface of each capacitor by the cutout units. The clamp device comprises clamp elements pulled above the frame element fingers. Each clamp element encloses a side surface of the frame element fingers of each frame element. The clamp elements and the frame element fingers are formed in geometric shapes where each clamp element presses each frame element finger in a direction towards each capacitor, and each frame element finger presses a surface of each capacitor. The capacitor mounting device is connected to the basic body. The capacitors of the power semiconductor device are mounted clearly, reliably, and economically almost without complexity.</p> |
