SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

The present invention relates to a semiconductor package capable of improving reliability and reducing warpage and a fabricating method thereof. As an example, a semiconductor package includes a semiconductor device which includes a circuit board which includes an insulating layer, a first line pattern formed on the upper side of the insulating layer, and a second line pattern formed on the lower side of the insulating layer, a semiconductor die mounted on the upper side of the circuit board, an encapsulant which encapsulates the semiconductor die in the upper part of the circuit board and has a through via for exposing the first line pattern to the outside, and a conductive bump which is formed in the through via and is electrically connected to the first line pattern; an interposer which is mounted on the upper part of the semiconductor device and includes an insulator, a line pattern formed on the lower side of the insulator, and a solder ball formed on the line pattern; and an interlayer member which is interposed between the semiconductor device and the interposer. The solder ball is electrically connected to the conductive bump. The interlayer member surrounds the conductive bump and the solder ball.