发明名称 エポキシアクリレート、アクリル系硬化性組成物、硬化物及びその製造法
摘要 <p>Provided are: an epoxy acrylate which exhibits excellent heat resistance and low thermal expansion and is useful for solder resist resins, electroless plating resist resins, hard coat materials, UV-curable coating materials, substitute materials for glass, color filters for liquid crystal displays, and so on; an acrylic composition; and a cured product. The epoxy acrylate is represented by general formula (1) [wherein Z is C1-6 alkyl; a is a number of 0 to 4; and n is an integer of 2 to 3]. The epoxy acrylate can be obtained by reacting an epoxycyclohexane compound with acrylic acid or methacrylic acid.</p>
申请公布号 JP5758923(B2) 申请公布日期 2015.08.05
申请号 JP20120556834 申请日期 2012.02.01
申请人 发明人
分类号 C08G59/17;C07C67/26;C07C69/54;C08F299/00 主分类号 C08G59/17
代理机构 代理人
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