| 发明名称 | Methods and apparatus for MEMS structure release | ||
| 摘要 | Methods and apparatus for MEMS release are disclosed. A method is described including providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one MEMS device; immersing the substrate including the at least one MEMS device in an organic solvent; and while the substrate is immersed in the organic solvent, removing water from the organic solvent until the water remaining in the organic solvent is less than a predetermined threshold. An apparatus is disclosed for performing the methods. Additional alternative methods are disclosed. | ||
| 申请公布号 | US9096428(B2) | 申请公布日期 | 2015.08.04 |
| 申请号 | US201313790550 | 申请日期 | 2013.03.08 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yang Tai-I;Chung Ming-Tai;Shue Hong-Seng;Lin Ming-Yi |
| 分类号 | H01L21/00;B81C1/00;B81B3/00 | 主分类号 | H01L21/00 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A method, comprising: providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from the at least one MEMS device; immersing the substrate including the at least one MEMS device in an organic solvent; and while the substrate is immersed in the organic solvent, removing water from the organic solvent until the water remaining in the organic solvent is less than a predetermined threshold. | ||
| 地址 | Hsin-Chu TW | ||