复合感测型式的微机电元件之制造方法及所制作之复合感测型式的微机电元件;MANUFACTURING METHOD OF MIXED MODE MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIXED MODE MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY

摘要

本发明提供一种复合感测型式的微机电元件之制造方法，包含：提供一积体电路晶圆；提供一结构层，接合于该积体电路晶圆之顶面；于该结构层上定义至少一第一感测型式微机电动作部与一第二感测型式微机电动作部；以及提供一封盖，与该结构层接合，形成至少一封闭工作空间以及至少一非封闭工作空间，以分别容纳该第一感测型式微机电动作部与该第二感测型式微机电动作部。; providing a structure layer bonded to a top face of the integrated circuit wafer; defining at least one first type motion part and a second type motion part in the structure layer; and providing a cap bonded to the structure layer to form at least one enclosed working space and at least one non-enclosed working space, wherein the enclosed working space and the non-enclosed working space respectively accommodate the first type motion part and the second type motion part.