| 摘要 |
本发明系有关于一种高度磨料品质之化学机械研磨修整器，包括：一基板；一结合层，该结合层系设置于该基板上；以及复数个研磨颗粒，该些研磨颗粒系埋设于该结合层，且该些研磨颗粒藉由该结合层以固定于该基板上；其中，该些研磨颗粒系具有一风险钻石含量，该风险钻石含量系经由一磨料筛选装置而测得。藉此，经由磨料筛选装置判断该风险钻石含量后，再制作形成高品质磨料之化学机械研磨修整器，以避免风险钻石在化学机械研磨过程中对于抛光垫产生的刮伤及破坏。; a bonding layer disposed on the substrate; and a plurality of abrasive particles placed on the bonding layer, and the abrasive particles are placed on the substrate by the bonding layer; wherein the abrasive particles have a risk diamond content measured by a screening apparatus for screening abrasive particles. Therefore, the chemical mechanical polishing conditioner with high quality abrasive particles is produced, after the content of the risk diamond is determined by the screening apparatus for screening abrasive particles, in order to avoid producing scratches and breakages caused by the risk diamonds during a chemical mechanical polishing process. |
