SURFACE INSPECTION APPARATUS FOR SEMICONDUCTOR CHIPS AND METHOD OF INSPECTING SURFACES OF SEMICONDUCTOR CHIPS USING THE SAME

摘要

Disclosed are an apparatus and a method for inspecting surfaces of semiconductor chips. A continuous wave laser with periodicity is generated and modified to generate a laser beam for an inspection, which has an optical section size smaller than the surface size of a semiconductor chip. Light is partially and simultaneously injected onto the surfaces of a plurality of semiconductor chips, the surfaces of the semiconductor chips are heated, and then a heat wave emitting from the semiconductor chips corresponding to the laser beam is detected, thereby generating a thermal image. A surface image indicating a defect on the surfaces of the semiconductor chips is obtained by performing an image process on the thermal image. The continuous wave laser with periodicity is partially and simultaneously injected onto the surfaces of the semiconductor chips to perform a surface inspection, thereby reducing a surface inspection time and increasing the accuracy of surface inspection.