发明名称 |
ELECTROMAGNETIC WAVE SHIELD SHEET, AND PRINTED WIRING BOARD WITH ELECTROMAGNETIC WAVE SHIELD SHEET |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed wiring board with an electromagnetic wave shield sheet which has a superior transmission characteristic, and never foams even when being exposed to a high temperature at lead-free solder reflow after moisture absorption.SOLUTION: An electromagnetic wave shield sheet comprises an insulative layer, a conductive layer and an adhesive layer. The conductive layer includes a resin and a conductive filler. The conductive layer has a surface specific resistance of 100 mΩ/sq. or less and a conductivity of 1×10S/m or more. A printed wiring board with an electromagnetic wave shield sheet comprises: a printed wiring board; and the electromagnetic wave shield sheet stuck to at least one surface of the printed wiring board.</p> |
申请公布号 |
JP2015138813(A) |
申请公布日期 |
2015.07.30 |
申请号 |
JP20140008158 |
申请日期 |
2014.01.20 |
申请人 |
TOYO INK SC HOLDINGS CO LTD |
发明人 |
MATSUZAWA TAKAHIRO;MARUYAMA KENJIRO;KOBAYASHI HIDENORI;INOUE SHOTA |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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