发明名称 ELECTROMAGNETIC WAVE SHIELD SHEET, AND PRINTED WIRING BOARD WITH ELECTROMAGNETIC WAVE SHIELD SHEET
摘要 <p>PROBLEM TO BE SOLVED: To provide a printed wiring board with an electromagnetic wave shield sheet which has a superior transmission characteristic, and never foams even when being exposed to a high temperature at lead-free solder reflow after moisture absorption.SOLUTION: An electromagnetic wave shield sheet comprises an insulative layer, a conductive layer and an adhesive layer. The conductive layer includes a resin and a conductive filler. The conductive layer has a surface specific resistance of 100 mΩ/sq. or less and a conductivity of 1×10S/m or more. A printed wiring board with an electromagnetic wave shield sheet comprises: a printed wiring board; and the electromagnetic wave shield sheet stuck to at least one surface of the printed wiring board.</p>
申请公布号 JP2015138813(A) 申请公布日期 2015.07.30
申请号 JP20140008158 申请日期 2014.01.20
申请人 TOYO INK SC HOLDINGS CO LTD 发明人 MATSUZAWA TAKAHIRO;MARUYAMA KENJIRO;KOBAYASHI HIDENORI;INOUE SHOTA
分类号 H05K9/00 主分类号 H05K9/00
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