ELECTROPLATING APPARATUS AND PROCESSING METHOD THEREOF

摘要

The present invention is capable of minimizing a distance from a product (that is, a cathode) to an anode to significantly reduce plating deviation since an anode plate separately is formed on each panel of the product. According to the present invention, an anode basket is manufactured in a mesh shape to smoothly supply a plating solution. Since a rectifier is separately added to each anode basket to supply current, a predetermined amount of the current can be supplied to the anode so as to reduce plating thickness deviation.