ARTICLES AND METHODS FOR CONTROLLED BONDING OF POLYMER SURFACES WITH CARRIERS

摘要

A substrate having a polymer bonding surface with a first surface energy, a carrier having a glass bonding surface with a second surface energy, and a plasma-polymerized surface modification layer releasably bonding the polymer bonding surface to the glass bonding surface. The plasma polymerized layer may be formed so as to decrease the surface energy of the glass bonding surface prior to bonding. And the substrate may by non-destructively debonded from the carrier after being subjected to a one hour vacuum anneal in an environment having a temperature of 120°C.