METHOD FOR PREPARING RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

摘要

The present invention provides a method for producing a resin composition whereby a filler having the particle size closer to a first particle size can be used by increasing dispersion properties of the filler in a resin and therefore physical properties such as adhesiveness or the like can be increased. The resin composition includes a filler (a) having an average particle size of Aμm, a filler (b) having an average particle size of Bμm, and a curable compound (c). Aμm and Bμm satisfy conditions represented by Inequalities (I) and (II). In addition, the method includes a step of agitating and mixing the filler (a) and the filler (b) before dispersing the filler (a) and the filler (b) in the curable compound (c). The inequality (I) is 3μm<=A<=20μm, and the inequality (II) is 0.0005×A<=B<=0.020×A.