LED module

摘要

An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LED chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with a bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.

主权项

1. An LED module comprising:
a first and a second LED chips spaced apart from each other; a third LED chip arranged at a position that is offset from a straight line connecting the first and the second LED chips, said position being between the first LED chip and the second LED chip in a spacing direction in which the first and the second LED chips are spaced apart from each other; a first lead including a first die bonding portion on which the first LED chip is mounted, a first wire bonding portion spaced apart from the first die bonding portion in the spacing direction, and a first mounting terminal surface for surface-mounting; a first wire connecting the first LED chip and the first wire bonding portion to each other; a second lead including a second die bonding portion on which the second LED chip is mounted and a second mounting terminal surface for surface-mounting; and a third lead including a third die bonding portion on which the third LED chip is mounted and a third mounting terminal surface for surface-mounting; wherein the first through the third mounting terminal surfaces are flush with each other, light from each of the first through the third LED chips is emitted in a direction in which the first through the third mounting terminal surfaces extend, the first lead is formed with a groove positioned between the first die bonding portion and the first wire bonding portion, the groove extending in a direction crossing the spacing direction, and the first wire bridges over the groove.