发明名称 |
Method for fabricating small-scale MOS device |
摘要 |
A method for fabricating a small-scale MOS device, including: preparing a substrate; forming a first trench in the substrate along a first side of the gate region and forming a second trench in the substrate along a second side of the gate region, the first side of the gate region opposite the second side of the gate region; forming a first lightly doped drain region and a second lightly doped drain region in the first trench and the second trench, respectively; forming a third trench in the substrate overlapping at least a first portion of the first lightly doped drain region and a fourth trench in the substrate overlapping at least a first portion of the second lightly doped drain region; and forming a source region and a drain region in the third trench and the fourth trench, respectively. |
申请公布号 |
US9093464(B2) |
申请公布日期 |
2015.07.28 |
申请号 |
US201113807306 |
申请日期 |
2011.10.09 |
申请人 |
CSMC TECHNOLOGIES FAB1 CO., LTD.;CSMC TECHNOLOGIES FAB2 CO., LTD. |
发明人 |
Wang Le |
分类号 |
H01L21/336;H01L29/66;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
Anova Law Group, PLLC |
代理人 |
Anova Law Group, PLLC |
主权项 |
1. A method for fabricating a small-scale metal-oxide semiconductor (MOS) device comprising:
preparing a substrate of a first conductivity type; forming a gate oxide layer on the substrate; forming a gate region on a portion of a top surface of the gate oxide layer; forming a first trench in the substrate along a first side of the gate region and passing through the gate oxide layer, and forming a second trench in the substrate along a second side of the gate region and passing through the gate oxide layer, the first side of the gate region being opposite to the second side of the gate region; forming a first lightly doped drain region and a second lightly doped drain region to substantially fill the first trench and the second trench, respectively, by a selective epitaxial growth, wherein a remaining portion of the gate oxide layer on the substrate allows the selective epitaxial growth to occur substantially within the first trench and the second trench in the substrate; forming a third trench in the substrate overlapping at least a first portion of the first lightly doped drain region and a fourth trench in the substrate overlapping at least a first portion of the second lightly doped drain region; and forming a source region and a drain region in the third trench and the fourth trench, respectively. |
地址 |
Wuxi CN |