NORMAL-TEMPERATURE BONDING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a stage mechanism capable of meeting demands for precise wafer alignment and large withstand load while offering a large stroke.SOLUTION: A lower stage mechanism (24) includes: a carriage (43) including a lower wafer holding unit (52) holding a lower wafer (34); an elastic guide (44); a positioning stage (41) which roughly moves the lower wafer holding unit (52); a fine movement mechanism which finely moves the lower wafer holding unit (52); and a carriage support base (42). When load is not applied from an upper stage mechanism (23) to the carriage (43), the elastic guide (44) supports the carriage (43) so that the carriage (43) does not come into contact with the carriage support base (42). When load is applied to the carriage (43) in a vertical direction by the upper stage mechanism (23), the carriage (43) elastically deforms so as to come into contact with the carriage support base (42).