| 摘要 |
PROBLEM TO BE SOLVED: To provide a microelectronic assembly that includes an impedance controlled wirebond and a reference wirebond to achieve a desired impedance for a signal conductor.SOLUTION: A microelectronic assembly 900 includes a microelectronic subassembly 930 and a microelectronic device 910. The microelectronic assembly 900 has ground contacts 980 connectable to the microelectronic subassembly 930, an element contact 990, and a source of a reference potential. A signal wirebond 965 is connected to a device contact 912 exposed at a surface of the microelectronic device 910 and provided with a reference wirebond 975 that is connected to two ground contacts of the microelectronic subassembly 930. The reference wirebond 975 has a signal conductor connected to the microelectronic device 910, such as a run which extends over a substantial portion of the length of the signal wirebond 965 at a uniform spacing from the signal wirebond 965. |
