发明名称 |
EXPOSURE DEVICE, METHOD FOR FORMING RESIST PATTERN, AND STORAGE MEDIUM |
摘要 |
[Problem] To provide a technology whereby it is possible to obtain high in-plane uniformity on a wafer (W), and high resolution of the line width of a pattern when forming a resist pattern. [Solution] A resist film is formed on a substrate and a pattern is exposed by means of a pattern exposure machine (C6), after which an entire pattern exposure region is exposed by using a one-shot exposure device (1). When doing so, the exposure amount is adjusted in accordance with the exposure position on the wafer (W) on the basis of information regarding the in-plane distribution of the line width of the resist pattern obtained from an inspection device (861 (862)) in advance. Examples of the means for adjusting the exposure amount include a means for adjusting the exposure amount while moving a band-shaped irradiation region corresponding to the diameter of the wafer (W), and a means for adjusting the exposure amount with regard to each chip by intermittently moving the irradiation region corresponding to a pattern exposure shot region. |
申请公布号 |
WO2015108015(A1) |
申请公布日期 |
2015.07.23 |
申请号 |
WO2015JP50593 |
申请日期 |
2015.01.13 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
NAGAHARA SEIZI;SHIRAISHI GOUSUKE;SHIMURA SATORU;YOSHIHARA KOUSUKE;KAWAKAMI SHINICHIRO;TOMONO MASARU;TERASHITA YUICHI;MIZOGUCHI HIRONORI |
分类号 |
H01L21/027;G03F7/20;G03F7/38 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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