发明名称 ADHESIVE COMPOSITION AND ADHESIVE FILM HAVING SAME, SUBSTRATE PROVIDED WITH ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (C), and inorganic particles (D), the ratio of the polyimide (A) in a nonvolatile organic component being 3.0 wt% to 30 wt%, the ratio of the epoxy curing agent (C) in the nonvolatile organic component being 0.5 wt% to 10 wt%, and T/M being 400 to 8000, where T is the total number of grams of the nonvolatile organic component, and M is the number of moles of epoxy groups in the nonvolatile organic component.
申请公布号 WO2015107990(A1) 申请公布日期 2015.07.23
申请号 WO2015JP50483 申请日期 2015.01.09
申请人 TORAY INDUSTRIES, INC. 发明人 ODA, TAKURO;KANAMORI, DAISUKE;NONAKA, TOSHIHISA
分类号 C09J179/08;C09J7/02;C09J11/04;C09J11/06;C09J163/00;H01L21/60 主分类号 C09J179/08
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