THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING THE SAME

摘要

In an embodiment, a thermal interface material (TIM) is provided. The TIM includes first and a second layers of a first transition metal, and a third layer including a plurality of carbon nanotubes supported in a flexible polymer matrix and a second transition metal coupled to sidewalls of carbon nanotubes. The first and second metal layers are in contact with first and second ends of carbon nanotube. The TIM further includes fourth and fifth layers of an alloy material coupled to the first and second metal layers, respectively. The carbon nanotube based TIM including the layers with transition metal allow improved heat transfer from an integrated circuit die to a heat spreader.

主权项

1. A method of manufacturing a thermal interface material (TIM), the method comprising:
forming a layer having a polymer matrix and a plurality of carbon nanotubes, wherein the layer includes first and second surfaces; coating at least a portion of a sidewall of at least one carbon nanotube of the plurality of carbon nanotubes; depositing a transition metal layer on the first and second surfaces of the layer; and depositing a non-transition metal layer on the transition metal layer.