| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To peel dry film resist with less faulty peeling in a semi-additive method of a buildup printed wiring board. <P>SOLUTION: In the manufacturing method of a buildup printed wiring board, a buildup printed wiring board is manufactured by the semi-additive method. Before a formed dry film resist is peeled, the dry film resist is dried. As a preprocessing of a dry film resist peeling process, the dry film resist is dried and shrunk so as to promote peeling on the interface of electrolytic copper plating and the dry film resist, thereby enhancing peelability of the dry film resist in peeling process. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
