| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in heat resistance and a moisture permeation barrier property and to provide a cured product of the composition.SOLUTION: This curable resin composition includes a base generator for generating a base by at least light irradiation, and a curable compound having at least one or more epoxy groups in a molecule. The base generated by the base generator is represented by general formula (I). In general formula (I), Rrepresents 1-6C alkylene group or -C-R-C-, and Rrepresents phenylene group or naphthylene group. |
