| 摘要 |
a new connection structure that connects a high frequency circuit and a waveguide, and enables standardization of a board aperture size without causing deterioration of a transmission path conversion characteristic; and a manufacturing method for said connection structure. [Solution] The invention comprises: a module board (1) on which the high frequency circuit (11) is mounted and that is provided with means (9 , 7) of conversion of a transmission path to the waveguide (3); a waveguide conductor (8) in which the waveguide is formed; and a parent board (2) that is provided on the waveguide conductor and comprises an aperture of a size larger than an aperture size (d) of the waveguide. The module board is affixed to the parent board so as to cover the aperture of the parent board, and a choke is formed using a space among the module board the parent board and the waveguide conductor. |
