LINEAR DEPOSITING SYSTEM FOR SUBSTRATE COOLING

摘要

The present invention relates to a linear depositing system for a substrate cooling and, more particularly to a linear depositing system which performs the processes serially by process chambers which are linearly arranged and include a deposition source device for a thin film deposition. The linear depositing system may include: a first reflective plate which is provided nearby the deposition region and separately from the deposition source device; and a second reflective plate which is provided at the upper side of the first plate and separately from the first reflective plate. The present invention suppresses the temperature rise of the substrate by blocking indirect convection current and radiation which are delivered from the deposition source device by a double reflective plates provided separately from the deposition source device.