发明名称 TRENCH POWER MOSFET AND MANUFACUTRING METHOD THEREOF
摘要 A trench power MOSFET and a manufacturing method thereof are provided. The trench power MOSFET has a buried oxide layer formed in the epitaxial layer, wherein the buried oxide layer is located under a body region for changing a vertical electric field distribution to increase a breakdown voltage of the MOSFET, thereby obtaining a lower on-state resistance.
申请公布号 US2015200294(A1) 申请公布日期 2015.07.16
申请号 US201414341939 申请日期 2014.07.28
申请人 SUPER GROUP SEMICONDUCTOR CO., LTD. 发明人 HSU HSIU-WEN
分类号 H01L29/78;H01L29/423;H01L21/762;H01L29/10;H01L21/311;H01L29/66;H01L29/06 主分类号 H01L29/78
代理机构 代理人
主权项 1. A trench power MOSEFT, comprising: a substrate having a first heavily doped region; an epitaxial layer formed above the substrate, wherein the epitaxial layer has a drift region; an oxide layer formed above the drift region; a channel region formed on one side of the oxide layer; a body region formed above the oxide layer and the channel region, wherein the channel region connects the body region and the drift region; a second heavily doped region formed above the body region; and a trench gate structure formed on the side of the second heavily dope region and the body region;wherein the channel region is formed between the trench gate structure and the oxide layer.
地址 NEW TAIPEI CITY TW