发明名称 |
TRENCH POWER MOSFET AND MANUFACUTRING METHOD THEREOF |
摘要 |
A trench power MOSFET and a manufacturing method thereof are provided. The trench power MOSFET has a buried oxide layer formed in the epitaxial layer, wherein the buried oxide layer is located under a body region for changing a vertical electric field distribution to increase a breakdown voltage of the MOSFET, thereby obtaining a lower on-state resistance. |
申请公布号 |
US2015200294(A1) |
申请公布日期 |
2015.07.16 |
申请号 |
US201414341939 |
申请日期 |
2014.07.28 |
申请人 |
SUPER GROUP SEMICONDUCTOR CO., LTD. |
发明人 |
HSU HSIU-WEN |
分类号 |
H01L29/78;H01L29/423;H01L21/762;H01L29/10;H01L21/311;H01L29/66;H01L29/06 |
主分类号 |
H01L29/78 |
代理机构 |
|
代理人 |
|
主权项 |
1. A trench power MOSEFT, comprising:
a substrate having a first heavily doped region; an epitaxial layer formed above the substrate, wherein the epitaxial layer has a drift region; an oxide layer formed above the drift region; a channel region formed on one side of the oxide layer; a body region formed above the oxide layer and the channel region, wherein the channel region connects the body region and the drift region; a second heavily doped region formed above the body region; and a trench gate structure formed on the side of the second heavily dope region and the body region;wherein the channel region is formed between the trench gate structure and the oxide layer. |
地址 |
NEW TAIPEI CITY TW |