发明名称 Prepreg, laminate obtained with the same and printed-wiring board
摘要 Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure.;A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.
申请公布号 US9079376(B2) 申请公布日期 2015.07.14
申请号 US201213352783 申请日期 2012.01.18
申请人 Hitachi Chemical Company, Ltd. 发明人 Kotake Tomohiko;Miyatake Masato;Nagai Shunsuke;Izumi Hiroyuki;Tsuchikawa Shinji;Takanezawa Shin;Murai Hikari
分类号 B32B17/00;B32B17/02;B32B25/20;B32B5/26;B32B5/28;B32B15/14;B32B15/20;C08J5/24 主分类号 B32B17/00
代理机构 Fitch Even Tabin & Flannery 代理人 Fitch Even Tabin & Flannery
主权项 1. A prepreg comprising a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of the thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure, said phase separation structure being a sea-island structure, wherein an occupying area ratio of an island portion of the sea-island structure per unit area on an observation surface of the layer made of a thermosetting resin composition is 10% or more to 45% or less, and wherein the thermosetting resin composition contains at least one of a cyanate resin and an unsaturated imide resin.
地址 Tokyo JP