发明名称 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
摘要 <p>The invention relates to a sensor arrangement (1) having a sensor housing (2) and a sensor (3) disposed therein, wherein the sensor housing (2) comprises a receiving unit (4) for receiving the sensor (3) and a cover element (5) for closing the receiving unit (4) in the region of the arrangement of the sensor (3). According to the invention the cover element (5) completely surrounds at least one end part-region of an outer surface of the accommodating unit (4), wherein a cross-section of the cover element (5) and a cross-section of the accommodating unit (4) at least in the joining region (F) of the cover element (5) are designed in such a way that the cover element (5) is disposed in a starting position having a clearance fit on the accommodating unit (4) and, in an end position rotated relative to the accommodating unit (4), at least in some sections an inner face of the cover element (5) rests against an outer surface of the accommodating unit (4) in the joining region (F). The invention further relates to a method for producing a sensor arrangement (1).</p>
申请公布号 DE112013004666(A5) 申请公布日期 2015.07.09
申请号 DE20131104666T 申请日期 2013.11.11
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 HENNINGER, JÜRGEN;REIF, ANDREAS;BAUER, GERHARD;WIECZOREK, MATTHIAS;KARRER, HELMUT;KEUTEN, MATTHIAS;HOFMANN, KONRAD;FARNBACHER, INGRID
分类号 G01D11/24;G01P1/02;H05K5/03 主分类号 G01D11/24
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