发明名称 半導体パワーモジュールのための接続配置
摘要 <p>A semiconductor power module (100) includes at least two sub modules (101-106). The sub modules (101-106) include at least one respective transistor (107) having a collector (108), an emitter (109) and a gate (110). Furthermore a connection arrangement is provided which includes a collector terminal unit (201) adapted for connecting the collectors of the at least two sub modules (101-106) collectively to external circuit components, at least two emitter terminal units (301-304) adapted for connecting the respective emitters (109) of the at least two sub modules (101-106) individually to external circuit components, and at least two gate terminal units (401-404) adapted for connecting the respective gates (110) of the at least two sub modules (101-106) individually to external circuit components.</p>
申请公布号 JP5744742(B2) 申请公布日期 2015.07.08
申请号 JP20110533717 申请日期 2009.10.29
申请人 发明人
分类号 H01L25/07;H01L25/18;H02M1/00 主分类号 H01L25/07
代理机构 代理人
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