CHIP ON GLASS TYPE SUBSTRATE FOR PACKAGING SUMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

摘要

The present invention relates to a substrate for mounting a semiconductor chip. The substrate comprises a base substrate which has heat radiation grooves on a lower surface; a first heat reduction pattern formed in the heat radiation grooves; first and second pad electrodes which are separated from each other on the base substrate; a second heat reduction pattern formed on the first and second pad electrodes; an insulating layer pattern formed on the second heat radiation pattern; a semiconductor chip which has first and second bumps touching the first and second pad electrodes on the lower surface; and an insulating layer which covers gaps between the first and second bumps of the lower part of the semiconductor chip and the first and second pad electrodes.