| 摘要 |
The present invention relates to a substrate bonding apparatus and a substrate bonding method capable of plurally proceeding a bonding process for a substrate having an OLED and a protective film mounted on the substrate in order to protect the OLED. The substrate bonding apparatus comprises: a chamber where a first substrate having the OLED, a plurality of first process substrates having first protective films mounted on the first substrate, and a plurality of first heat transfer portions which are arranged between the first process substrates are stacked and carried; a first heating plate arranged inside the chamber, and where the first process substrates and the first heat transfer portions, which are respectively arranged between the first process substrates, are mounted; a pressing plate arranged to face the first heating plate inside the chamber; and a transfer portion for transferring the first heating plate to the pressing plate in order to make the first substrates and the first protective films be heat-bonded. Therefore, since the present invention plurally enables to proceed the bonding process for the substrate which supports the OLED and the protective film which is mounted on the substrate in order to protect the OLED, productivity of a display apparatus is able to be improved. |
