发明名称 ENCAP FILM JIG
摘要 <p>The present invention relates to an encapsulation film jig which includes a plate, a first receiving unit which is arranged on the upper side of the plate and receives one region of an encapsulation film by arranging a first through hole with a preset interval to absorb the encapsulation film, and a second receiving unit which is arranged on the upper side of the plate and receives the other region of the encapsulation film by arranging a second through hole with an interval which is larger than the arrangement interval of the first through hole arranged on the first receiving unit. According to the present invention, the convenience and the speed of a process are improved by receiving the encapsulation film on the jig by corresponding to various sizes of films by designing holes with various intervals on the front end of the jig to correspond to multi-sizes.</p>
申请公布号 KR20150077138(A) 申请公布日期 2015.07.07
申请号 KR20130166041 申请日期 2013.12.27
申请人 LIGADP CO., LTD. 发明人 HWANG, JAE SEOK
分类号 H01L51/52;H01L51/56 主分类号 H01L51/52
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